SK Hynix this week revealed some additional technical details about its upcoming DDR5-6400 memory chip at the International Solid State Circuits Conference. The die size of the company’s 16 Gb DDR5 chip is at a high end of historical DRAM die sizes, so the cost of the device will likely be quite high. However, the increased DRAM density per square millimeter will likely enable SK Hynix to build rather cost effective 8 Gb DDR5 ICs.
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