ATP’s DDR4-3200 Industrial DIMMs: Up to 128GB @ 1.2V for AMD & Intel

ATP has unveiled its latest memory modules for servers and industrial applications, boasting a 3200 MT/s data transfer rate, an industry-standard voltage, and capacities ranging from 2 GB to 128 GB. The modules are available in various form-factors and configurations to address a variety of designs.

ATP’s family of server/embedded/industrial DDR4-3200 at 1.2 V memory modules are validated to work with AMD’s EPYC 7002-series as well as Intel’s 2^nd Generation Xeon Scalable CPUs, and are ready for AMD’s upcoming Milan and Genoa CPUs, as well as Intel’s Cooper Lake and Ice Lake processors. ATP uses a variety of certified memory chips for different modules featuring capacities ranging from 2 GB to 128 GB (e.g., the former uses 4 Gb chips, whereas the latter relies on 16 Gb dies).

The industrial-grade modules from ATP use special PCBs featuring thicker gold contacts, PCB underfill, conformal coating, and anti-sulfur resistors that are meant to protect DIMMs from shock/vibration, electromagnetic disturbance, humidity, and harsh chemicals in the air. Also, like other industrial components they are rated for extreme temperatures from –40°C to +85°C. Last but not least, these modules undergo module-level test during burn-in (TDBI) to reveal weak DIMMs that can produce errors.

Given that ATP’s family of DDR4-3200 at 1.2 V modules for server/embedded/industrial are aimed at a variety of designs, they come in LRDIMM, RDIMM, UDIMM, UDIMM ECC, SO-RDIMM, SO-DIMM, SO-DIMM ECC, Mini-RDIMM, and Mini-UDIMM ECC form-factors. Meanwhile, unbuffered DDR4-3200 modules are available in SO-DIMM, UDIMM, ECC UDIMM, ECC SO-DIMM, and RDIMM configurations.

The new DDR4-3200 DIMMs from ATP are expected to be available shortly, at prices that will depend on configurations and form-factors.

Related Reading:

• Transcend Introduces Extreme Temperature DDR4 SO-DIMMs
• ATP Unveils N600S-Series Industrial SSDs w/ MCU-Based Power Loss Protection
• ATP Launches M.2 NVMe SSDs: 3D MLC, SMI, Extreme Temps, Up to 2.5 GB/s
• ATP Announces eMMC5.1 3D NAND Storage For Extreme Temperatures

Source: ATP

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